By K. L. Mittal, Tanweer Ahsan
This entire booklet will supply either basic and utilized facets of adhesion bearing on microelectronics in one and simply obtainable resource. one of the themes to be coated include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of fabrics because it relates to adhesion
- Surface cleansing because it relates to adhesion
- Ways to enhance adhesion
- Unraveling of interfacial interactions utilizing an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to numerous substrates
- Adhesion of skinny films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of alternative dielectric materials
- Delamination and reliability matters in packaged devices
- Interface mechanics and crack propagation
- Adhesion size of skinny movies and coatings
Read or Download Adhesion in Microelectronics PDF
Similar microelectronics books
Collect the layout details, equipment, and talents had to grasp the recent VLIW structure! VLIW Microprocessor layout will give you a whole consultant to VLIW design—providing state of the art assurance of microarchitectures, RTL coding, ASIC move, and FPGA move of layout.
The booklet offers the long run advancements and options within the constructing box of microelectronics. The book’s chapters include contributions from a variety of authors, all of whom are major execs affiliated both with most sensible universities, significant semiconductor businesses, or executive laboratories, discussing the evolution in their occupation.
Additional resources for Adhesion in Microelectronics
52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. r. study of an adduct of n-propylamine and 1,2-epoxy butane, Spectrochim. Acta, 40B, 847–851 (1985). S. D. Senturia, Polyimides in microelectronics, in: Polymers for High Technology, Electronics and Photonics, M. J. Bowden and S. R. ), pp 428–436, American Chemical Society, Washington DC (1987). R. D. Ramsier and P. N. Henriksen, Vibrational spectroscopy of phthalimides adsorbed on alumina: Models for polyimide adhesion, Appl. Spectroscopy, 44, 37–41 (1990).
Sci. , 102, 8838–8843 (2005). A. Troisi and M. A. Ratner, Propensity rules for inelastic electron tunneling spectroscopy of single-molecule transport junctions, J. Chem. , 125, 214709–214709-11 (2006). 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics. , Sunnyvale, CA, USA Abstract Microelectronic devices and packages represent a most important class of complicated adhering systems made of multilayer dissimilar film stacks, the integrity and reliability of which depend on the cohesive strength as well as on the interfacial adhesion of films.
Wiley and Sons, New York (1988). 33. R. R. Mallik, P. N. Henriksen, T. , W. J. , and T. Confer, Characterization of ultrathin sputtered SiO films on alumina by inelastic electron tunneling spectroscopy and atomic force microscopy, J. Vac. Sci. Technol. A 10, 2412–2418 (1992). 34. C. N. Banwell, Fundamentals of Molecular Spectroscopy, third edition, p 18, McGraw Hill International (UK), London (1983). 35. K. W. Hipps and U. Mazur, Constant-resolution tunneling spectroscopy, Rev. Sci. , 59, 1903–1905 (1988).
Adhesion in Microelectronics by K. L. Mittal, Tanweer Ahsan