CMOS-MEMS: Advanced Micro and Nanosystems by Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer PDF

By Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Osamu Tabata

ISBN-10: 3527310800

ISBN-13: 9783527310807

Microstructures, electronics, nanotechnology - those monstrous fields of study are becoming jointly because the dimension hole narrows and plenty of varied fabrics are mixed. present learn, engineering sucesses and newly commercialized items trace on the substantial cutting edge potentials and destiny purposes that open up as soon as mankind controls form and serve as from the atomic point correct as much as the obvious global with none gaps.Sensor platforms, microreactors, nanostructures, nanomachines, practical surfaces, built-in optics, monitors, communications know-how, biochips, human/machine interfaces, prosthetics, miniaturized clinical and surgical procedure gear and plenty of extra possibilities are being explored.This new sequence, complex Micro and Nano structures, presents state of the art stories from most sensible authors on applied sciences, units and complicated structures from the micro and nano worlds.

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Sample text

Commercially available examples of polysilicon microstructures, fabricated with CMOS/BiCMOS processes with intermediate micromachining, include Analog Devices ADXL series accelerometers and ADXRS series gyroscopes [220], Infineon Technologies’ KP100 series pressure sensors [42] and Freescale’s (Motorola) MPXY8000 series pressure sensors [221]. Not surprisingly, all three companies have in-house IC processing capabilities, facilitating the chosen interleaved process sequences and allowing fine-tuning of the overall process sequence to minimize degradation in both electronic and mechanical components.

In the following, the fundamental micromachining techniques are reviewed. More details on micromachining techniques can be found in dedicated books on microsystem technology [56–59]. The micromachining techniques are categorized into bulk micromachining [60] and surface micromachining processes [61] (see Fig. 10). In the case of bulk micromachining, the microstructure is formed by machining the relatively thick bulk substrate material, whereas in the case of surface micromachining, the microstructure comprises thin-film layers, which are deposited on top of the substrate and selectively removed in a defined sequence to release the MEMS structure.

8). In the case of the sensor arrays for neural activity recording, the sensor electrodes and the contact pads are defined by depositing and liftoff patterning of a Ti/Pt layer. Subsequently, a dielectric layer sandwich consisting of different TiO2 and ZrO2 layers is deposited and opened at the location of the bond pads. Neural activity is recorded capacitively with the sensor electrodes covered by the protective dielectric layer sandwich. Finally, a gold layer is deposited on the Pt pads and structured using a lift-off process [31].

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CMOS-MEMS: Advanced Micro and Nanosystems by Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Osamu Tabata


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