By John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
* An engineer's guidebook demonstrating non-toxic electronics production processes
* Covers manufacture of revealed circuits, built-in circuits, published circuit forums assemblies, digital programs, and extra
Read or Download Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive PDF
Best microelectronics books
Collect the layout info, tools, and abilities had to grasp the recent VLIW structure! VLIW Microprocessor layout provide you with an entire advisor to VLIW design—providing state of the art insurance of microarchitectures, RTL coding, ASIC movement, and FPGA circulation of layout.
The publication provides the longer term advancements and ideas within the constructing box of microelectronics. The book’s chapters include contributions from quite a few authors, all of whom are top execs affiliated both with best universities, significant semiconductor businesses, or govt laboratories, discussing the evolution in their career.
Extra resources for Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive
L. Poeschel, “Tin Whisker Induced Failure in Vacuum,” 18th International Symposium for Testing and Failure Analysis, pp. 407–412, October 17, 1992. 128. Park, H. , “Requirements to Preclude the Growth of Tin Whiskers,” NASA Memo, NASA Parts Project Office—Code 310, Goddard Space Flight Center to QR/Director, Reliability, Maintainability, and Quality Assurance Division, February 14, 1992. 20 CHAPTER ONE 129. Backes, P. , “Selected Programs Shorting Failure Investigation Final Report (FASS 1298),” Hughes Technical Internal Correspondence, October 16, 1991.
5Ag solder and 210°C for 63Sn-37Pb solder. The focus is on the growth of the Ni3Sn4 IMC layer and the P-rich Ni layer for different reflow times. It has been known that the longer the reflow times, the larger the growth rate and that these layers can have an undesirable effect, resulting in a serious degradation of solder joint reliability. 25 shows the growth rate of the Ni3Sn4 IMC layer and the P-rich Ni layer for reflow times1/2. 24 Kirkendall voids. (a) For Sn-Pb solder, reflow at 250°C for 4 min; (b) for Sn-Ag solder, reflow at 250°C for 256 min.
Balde, Multichip Modules: System Advantages, Major Construction, and Materials Technologies, IEEE, New York, 1991. 27. Sandborn, P. , and H. Moreno, Conceptual Design of Multichip Modules and Systems, Kluwer, New York, 1994. 28. Nash, F. , Estimating Device Reliability: Assessment of Credibility, Kluwer, New York, 1993. 29. Gyvez, J. , Integrated Circuit Defect-Sensitivity: Theory and Computational Models, Kluwer, New York, 1993. 30. Doane, D. , and P. D. Franzon, Multichip Module Technologies and Alternatives, Van Nostrand Reinhold, New York, 1992.
Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive by John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee