By Andrew E. Perkins, Suresh K. Sitaraman
Solder Joint Reliability Prediction for a number of Environments will supply engineers, graduate scholars and educational researchers, and reliability specialists with insights and precious instruments for comparing solder joint reliability of ceramic zone array digital programs below a number of environments. the fabric awarded this is no longer constrained to ceramic region array programs merely, it could possibly even be used as a technique for concerning numerical simulations and experimental information into an easy-to-use equation that captures the fundamental details had to are expecting solder joint reliability. this kind of method is usually had to relate advanced info in an easy demeanour to managers and non-experts in solder joint who paintings with computing device server functions in addition to for harsh environments reminiscent of these present in the safety, space, and automobile industries.
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Solder Joint Reliability Prediction for a number of Environments will offer engineers, graduate scholars and educational researchers, and reliability specialists with insights and worthy instruments for comparing solder joint reliability of ceramic zone array digital applications below a number of environments.
This variation is an entire revision and features a good deal of latest material together with info on ferrous powder metallurgy, forged irons, extremely excessive power steels, furnace atmospheres, quenching strategies, SPC and machine know-how. information on over one hundred thirty five extra irons and steels were additional to the previously-covered 280 alloys.
Papers from a November 1999 assembly study warmth treating and linked industries, bearing on points of regulate of microstructure via warmth therapy, gear and techniques, forge heating with induction, quenching and distortion, and metal warmth treating within the new millennium. topics inclu
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A Concept of Fatigue Damage," Trans. ASME, 1954, 76(4), p. 627-632. , "Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization Using Photomechanics Methods," Journal of Thermal Stresses, 2003, 26(6), p. 583. , High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials, Mechanical Engineering Series, 1994, NY: Springer-Verlag. , "Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization Using Photomechanics Methods", 2003, Blacksburg, VA, USA: Taylor & Francis.
The question of whether γATC or γPC is greater depends on how close the substrate CTE, αsub, matches the PWB CTE, αPWB, which typically has a range of 1824 ppm/C. For ceramic packages αsub <αPWB so that γATC > γPC. For ceramic packages, ATC tests lead to conservative estimates of PC fatigue life. Park et al.  performed numerical analysis and laser moiré experiments and have shown that PC can be more detrimental for PBGA while ATC is more detrimental for CBGA. Hong and Yuan  used FEM to study CBGA and found that ATC conditions can be 6-19x more conservative than PC conditions.
In order to avoid resonance, the natural frequency of the system is often changed as it is usually not feasible to 30 Background change the frequencies of the environmental forces that act upon the system. 22) the natural frequency ωn can be changed by either increasing the system’s stiffness k or by decreasing the mass m of the system. Typically, stiffeners are added to the PWB board in order to increase the stiffness of the system. Additionally, the amplitude at resonance can be significantly lowered by increasing the damping ratio ζ with rubber mounts or snubbers.
Solder Joint Reliability Prediction for Multiple Environments by Andrew E. Perkins, Suresh K. Sitaraman